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Oxygen Sensor Electronics – Hybrid EMS Assembly by BHC
For this high-precision oxygen sensing system, BHC provided the electronic manufacturing and assembly of the sensor electronics and hybrid module technology used in the device. The system is designed to measure oxygen concentration with high accuracy and fast response times, making it suitable for breathing and gas monitoring applications.
The sensor architecture includes a ceramic flow channel around the sensing chip, allowing gas to pass the sensor indirectly. This ensures fast gas refresh around the sensing element while preventing the sensor from acting as a flow detector. As a result, the system can perform highly accurate thermal conductivity measurements and determine oxygen concentration with a resolution of approximately 0.5% O₂.
Through its expertise in Electronic Manufacturing Services (EMS), OEM and ODM assembly, BHC integrates advanced electronics such as thin ceramic substrates, hybrid thick-film technology and rigid-flex PCB assemblies. These technologies enable compact sensor modules with stable performance and high reliability in demanding medical and research environments.
Precision
Precision Oxygen Measurement Electronics
The oxygen sensor module relies on precision hybrid electronics assembled by BHC. By integrating thin ceramic substrates with rigid-flex PCB technology and accurate thermal sensing electronics, the module delivers reliable oxygen concentration measurements with fast response times and high resolution.
Flexibility
CUTTING-EDGE TECHNOLOGY
Thin 0.25 mm Al₂O₃ ceramic substrates (96%) providing stable thermal and electrical properties for precision sensor electronics. Hybrid thick-film technology combined with flex PCB soldering enabling compact integration of sensor electronics. Rigid-flex PCB architecture allowing reliable interconnection between sensor components and control electronics.
Reliability
KEY FEATURES
🔹Fine line electronic assembly enabling compact and precise sensor module construction.
🔹Hot-bar soldering technology ensuring reliable connections in hybrid and flex PCB assemblies.
🔹Robust and reliable sensor module design suitable for demanding medical and analytical environments.
IDEAL FOR
🔹Research & Analytical Equipment
🔹Medical Technology
🔹Healthcare & Care Applications
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- Precision oxygen sensor electronics assembled by BHC using ceramic substrates, hybrid thick-film technology and rigid-flex PCB design. Designed for medical, research and analytical applications.
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- Precision rigid-flex PCB assembly for oxygen sensing technology
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- This substrate has a heater and Mems sensor integrated. On this substrate there will be a special processing CPU bonded.
