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Ceramic Substrates and Isolation Carriers for Power Electronics
Ceramic substrates and isolation carriers are widely used in power electronics and hybrid thick-film circuits where high electrical insulation and efficient thermal management are required. Alumina ceramic substrates provide excellent galvanic isolation while maintaining strong thermal conductivity, making them ideal for demanding industrial, energy and lighting applications. Their mechanical strength, corrosion resistance and high temperature stability ensure reliable performance even in extreme operating environments.
Precision
High Thermal Conductivity Ceramic Substrates
The ceramic substrates are manufactured using hybrid thick-film metallization on alumina ceramic materials. This combination provides highly reliable electrical insulation while enabling efficient heat dissipation and stable performance in power electronics and high-temperature applications.
Flexibility
CUTTING-EDGE TECHNOLOGY
Laser cutting technology enabling highly accurate substrate dimensions and custom shapes Laser scribing processes allowing precise separation and patterning of ceramic substrates Hybrid thick-film metallization ensuring reliable electrical connections and circuit integration
Reliability
KEY FEATURES
🔹High dielectric strength up to 20 kV/mm providing excellent electrical insulation
🔹Thermal conductivity of 24 W/m·K enabling efficient heat dissipation for power electronics
🔹Zero humidity absorption ensuring stable performance in harsh environments
IDEAL FOR
🔹Industrial
🔹Energy
🔹Lighting
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- Ceramic substrate isolation carrier for hybrid thick film electronics
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- Alumina ceramic substrate providing electrical insulation and thermal conduction for industrial electronics.